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个人信息Personal Information
副教授
博士生导师
硕士生导师
性别：女
毕业院校：伦敦帝国理工学院
学位：博士
所在单位：机械工程学院
学科：机械制造及其自动化. 材料加工工程
办公地点：知方楼5007
联系方式：13842856182
电子邮箱：baiqian@dlut.edu.cn
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- [1]Yin, Jingfei, Bai, Qian, Haitjema, Han, Zhang, Bi.Two-dimensional detection of subsurface damage in silicon wafers with polarized laser scatterin...[J],JOURNAL OF MATERIALS PROCESSING TECHNOLOGY,2022,284
- [2]Bai, Qian, Wu, Bingzhe, Qiu, Xiaoling, Zhang, Bi, Chen, Juanjuan, Q (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China..Experimental study on additive/subtractive hybrid manufacturing of 6511 steel: process optimiza...[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2020,108(5-6):1389-1398
- [3]Bai, Qian, Feng, Heng, Si, Likun, Pan, Ran, Wang, Yiqi.A Novel Stress Relaxation Modeling for Predicting the Change of Residual Stress During Annealin...[J],METALLURGICAL AND MATERIALS TRANSACTIONS A PHYSICAL METALLURGY AND MATERIAL,2022,50(12):5750-5759
- [4]Bai, Qian, Shi, Zhusheng, Lin, Jianguo, Trevor Dean, Mohamed, M..Application of a continuum damage mechanics (CDM)-based model for predicting formability of war...[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2022,88(9-12):3437-3446
- [5]Du, Wei, Bai, Qian, Zhang, Bi.Machining characteristics of 18Ni-300 steel in additive/subtractive hybrid manufacturing[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2022,95(5-8):2509-2519
- [6]Zhang, Bi, Li, Yongtao, Bai, Qian.Defect Formation Mechanisms in Selective Laser Melting: A Review[J],Chinese Journal of Mechanical Engineering,2022,30(3):515-527
- [7]Yin, Jingfei, Bai, Qian, Zhang, Bi.Methods for Detection of Subsurface Damage: A Review[J],Chinese Journal of Mechanical Engineering,2022,31(1)
- [8]Du, Wei, Bai, Qian, Wang, Yibo, Zhang, Bi.Eddy current detection of subsurface defects for additive/subtractive hybrid manufacturing[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2022,95(9-12):3185-3195
- [9]Yin, Jingfei, Bai, Qian, Zhang, Bi.Subsurface Damage Detection on Ground Silicon Wafers Using Polarized Laser Scattering[J],JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING TRANSACTIONS OF THE ASME,2022,141(10)
- [10]Yang, Xiuxuan, Bai, Qian, Zhang, Bi.Grain size influence on chip formation in high-speed machining of pure iron[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2022,108(5-6):1357-1366
- [11]Yang, Xiuxuan, Zhang, Bi, Xie, Guoyin, Bai, Qian.Correlation of microstructure and mechanical properties of Ti2AlNb manufactured by SLM and heat t...[J],INTERMETALLICS,2022,139
- [12]Qiao, Guowen, Zhang, Bi, Dilnoza, Yuvasheva, Bai, Qian.Effect of Heat Treatment on Microstructure and Residual Stress of GH3536 Superalloy Fabricated by...[J],JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE,2022
- [13]丁宝洋, 白倩, 刘具龙, 张璧.基于Simulink反馈方法的钛合金铣削刀具磨损预测[J],机械工程学报,2022,55(11):224-232
- [14]王龙群, 张璧, 彭颖, 谢国印, 白倩, 王义博.增减材复合制造内部缺陷的涡流检测[J],航空学报,2022,41(3):287-295
- [15]冯一琦, 谢国印, 张璧, 乔国文, 高尚, 白倩.激光功率与底面状态对选区激光熔化球化的影响[J],航空学报,2022,40(12):229-238
- [16]白倩, 马浩, 殷景飞.基于偏振激光共聚焦的研磨石英玻璃亚表面损伤检测[J],Guangxue Jingmi Gongcheng/Optics and Precision Engineering,2022,29(8):1795-1803
- [17]李庆鹏, 张璧, 白倩.Detection of subsurface microcracks after grinding of single crystal silicon wafer by polarized l...[J],Jingangshi yu Moliao Moju Gongcheng/Diamond and Abrasives Engineering,2022,40(4):87-92
- [18]刘具龙, 张璧, 白倩, 程博.钛合金铣削刀具/工件接触区域温度预测[J],航空学报,2022,39(12):358-369
- [19]Yin, Jingfei, Bai, Qian, Li, Yinnan, Zhang, Bi.Formation of subsurface cracks in silicon wafers by grinding[J],纳米技术与精密工程,2022,1(3):172-179
- [20]Zhao, Linjie, Wang, Yiqi, Zhou, Ping, Bai, Qian, Yan, Ying.Surface roughness measurement accuracy analysis of grinded silicon wafer by white light scannin...[A],OPTICAL MEASUREMENT SYSTEMS FOR INDUSTRIAL INSPECTION XI,2022,11056