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论文类型：期刊论文

发表时间：2013-12-01

发表刊物：INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

收录刊物：SCIE、EI、Scopus

卷号：69

期号：9-12

页面范围：2621-2627

ISSN号：0268-3768

关键字：Nanogrinding; Undeformed chip thickness; Brittle-ductile transition; CdZnTe; Surface roughness

摘要：Nanogrinding was conducted on soft-brittle cadmium zinc telluride (CdZnTe or CZT) wafers using a ceramic bond ultrafine diamond wheel. Surface roughness R (a) and PV achieved by nanogrinding are 1.5 and 12.2 nm, respectively. The highest feed rate was 83.3 nm/r, which is lower than 89 nm that is the critical value of brittle-ductile transition for CZT. As a result, ductile grinding was obtained. A novel model for wafer rotational grinding of undeformed chip thickness was proposed, based on the kinematics and geometric characteristics between wheel and workpiece. The undeformed chip thickness simulated was used to elucidate the fundamental mechanism for nanogrinding conditions, and it is in good agreement with the results found experimentally.