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Date of Publication:2009-01-01

Journal:人工晶体学报

Issue:2

Page Number:416-421

ISSN No.:1000-985X

Abstract:A novel kind of self-developed chemical mechanical polishing slurry was employed to polish the CZT crystals. The effects of hardness of polishing pad, variety of abrasives, oxidizer and pH value of slurry on the surface quality and materials removal rate of CZT crystals were analyzed, and a kind of optimal process was achieved. The results show that ultra-smooth and damage-free surface with surface roughness Ra of 0.67 nm of CZT crystal is obtained, when the pH value of slurry is 2.5 and polishing duration is 15 min, which obviously improves the machining efficiency and precision, compared with the traditional machining method.

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