Release Time:2019-03-09  Hits:

Indexed by: Journal Article

Date of Publication: 2010-06-01

Journal: RARE METALS

Included Journals: CSCD、EI、SCIE

Volume: 29

Issue: 3

Page Number: 276-279

ISSN: 1001-0521

Key Words: lapping; mechanical polishing; wafers; surface; subsurface; abrasive

Abstract: CdZnTe wafers were machined by lapping and mechanical polishing processes, and their surface and subsurface damages were investigated. The surface damages are mainly induced by three-body abrasive wear and embedded abrasive wear during lapping process. A new damage type, which is induced by the indentation of embedded abrasives, is found in the subsurface. When a floss pad is used to replace the lapping plate during machining, the surface damage is mainly induced by two-body abrasive and three-body abrasive wear, and the effect of embedded abrasives on the surface is greatly weakened. Moreover, this new damage type nearly disappears on the subsurface.