Hits:
Indexed by:期刊论文
Date of Publication:2010-06-01
Journal:RARE METALS
Included Journals:SCIE、EI、CSCD
Volume:29
Issue:3
Page Number:276-279
ISSN No.:1001-0521
Key Words:lapping; mechanical polishing; wafers; surface; subsurface; abrasive
Abstract:CdZnTe wafers were machined by lapping and mechanical polishing processes, and their surface and subsurface damages were investigated. The surface damages are mainly induced by three-body abrasive wear and embedded abrasive wear during lapping process. A new damage type, which is induced by the indentation of embedded abrasives, is found in the subsurface. When a floss pad is used to replace the lapping plate during machining, the surface damage is mainly induced by two-body abrasive and three-body abrasive wear, and the effect of embedded abrasives on the surface is greatly weakened. Moreover, this new damage type nearly disappears on the subsurface.