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论文类型： 会议论文

发表时间： 2012-03-18

收录刊物： EI、CPCI-S、Scopus

卷号： 44

期号： 1

页面范围： 885-890

摘要： Nowadays, with the continuous miniaturization of electronic packages, the solder balls used to join chips and substrates are downsizing. While the decrease in solder size may have a detrimental effect on the reliability of solder joints. In this paper, Sn-3.0Ag-0.5Cu solder balls were reflow soldered on two kinds of pads (Cu and Ni-P) to give a comparative study of the volume effect. Cu/Sn-3.0Ag-0.5Cu and Ni-P/Sn-3.0Ag-0.5Cu joints displayed volume effect of different forms. In the reaction of Cu/Sn-3.0Ag-0.5Cu, scallop-type Cu6Sn5 grains formed at the interface. The grain size and thickness of Cu6Sn5 IMC together with the Cu consumption were influenced by solder volume. In the reaction of Ni-P/Sn-3.0Ag-0.5Cu, different type of interfacial IMCs formed for solder balls with different sizes. Changes of Cu content in solder balls play an important role in both kinds of reactions.