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论文类型： 会议论文

发表时间： 2018-01-01

收录刊物： CPCI-S

页面范围： 1363-1367

关键字： Sn-Au solder; Sn-Au-Cu-In; microstructure; mechanical properties; cluster-phis-glue-atom model

摘要： In order to improve the mechanical properties of Sn-Au-Cu solder, Indium was added into Sn-Au-Cu solder and five kinds of Sn-Au-Cu-In solders were designed based on cluster-plus-glue-atom (CPGA) model and the melting properties, microstructure, wettability, interfacial reaction and mechanical properties were studied systematically. The DSC results showed that the addition of In reduced the melting point of the Sn-Au-Cu-In solder. The microstructure of Sn-2.85Au-2.34Cu-0.65In solder consisted of white AuSn4 phase, little Cu6Sn5 phase and gray beta-Sn matrix, while the other 4 solders consisted of white Au(Sn,In)(4) phase, little Cu6Sn5 phase and gray beta-Sn matrix. The wettability of five solders on Cu substrate were better than those on Ni substrate. The wettability of Sn-2.81Au-0.89Cu-3.21In solder on Cu substrate was the best; while that of Sn-2.85Au-2.34Cu-0.65In solder on Ni substrate was the best. The shear strength of Sn-2.85Au-2.34Cu-0.651n solder joint was 72 MPa, which was the highest among the five solders.