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发表时间：2022-10-09

发表刊物：金刚石与磨料磨具工程

期号：2

页面范围：26-32

ISSN号：1006-852X

摘要：Several rectangular section grooves were cut on a polished surface of monocrystal silicon using creep feed grinding (CFG) with resin-bonded diamond wheels and metal bonded ones respectively.The effect of bond,wheel speed and table speed on surface quality was investigated.Experimental results demonstrated that the edge chipping size of the grooves was smaller and that the side wall quality ground with the resin bond wheel was better than that with the metal bonded grinding wheel.The edge chipping could be reduced significantly when the surface of the silicon to be ground was protected by a silicon cover.

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