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个人信息Personal Information
教授
博士生导师
硕士生导师
主要任职：材料科学与工程学院副院长
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：材料科学与工程学院
学科：材料学
办公地点：知远楼B515(新材料大楼)
电子邮箱：zhaoning@dlut.edu.cn
Microstructure and interfacial reactions of Sn-Au-Ag solder joints on Cu and Ni substrates
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论文类型：会议论文
发表时间：2016-08-16
收录刊物：EI、CPCI-S、SCIE、Scopus
页面范围：534-537
关键字：Au-Sn solder; Microstructure; Wettability; Interface reaction
摘要：Novel Sn-rich Au-Sn solder alloys were designed using the cluster-plus-glue-atom (CPGA) model and calculation of phase diagrams (CALPHAD) method, and the melting behavior, microstructure, wettability and interfacial reactions of the designed Sn-Au-Ag solders were systematically investigated. The melting temperature of Sn-Au-Ag solder is among the range of 205.86 to 206.63 degrees C. The microstructure of the Sn-Au-Ag bulk solders consists of the AuSn4 and Ag3Sn phases dispersed in beta-Sn matrix. The Sn-Au-Ag solders have the better wettability on Ni substrate than that on Cu substrate.