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论文类型： 会议论文

发表时间： 2016-08-16

收录刊物： EI、CPCI-S、SCIE、Scopus

页面范围： 534-537

关键字： Au-Sn solder; Microstructure; Wettability; Interface reaction

摘要： Novel Sn-rich Au-Sn solder alloys were designed using the cluster-plus-glue-atom (CPGA) model and calculation of phase diagrams (CALPHAD) method, and the melting behavior, microstructure, wettability and interfacial reactions of the designed Sn-Au-Ag solders were systematically investigated. The melting temperature of Sn-Au-Ag solder is among the range of 205.86 to 206.63 degrees C. The microstructure of the Sn-Au-Ag bulk solders consists of the AuSn4 and Ag3Sn phases dispersed in beta-Sn matrix. The Sn-Au-Ag solders have the better wettability on Ni substrate than that on Cu substrate.