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个人信息Personal Information
教授
博士生导师
硕士生导师
主要任职：材料科学与工程学院副院长
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：材料科学与工程学院
学科：材料学
办公地点：知远楼B515(新材料大楼)
电子邮箱：
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- [1]乔媛媛.Lai, Yanqing,梁红伟,赵宁.郝泰坤.Combined effect of Ag element and temperature gradient on the formation of highly orientated Sn grains in micro solder joints[J],JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T,2024,31:2994-3002
- [2]刘笛.乔媛媛,马浩然,董伟,赵宁.白天越.Laser jet solder ball bonding of SAC305/Cu BGA joints: Microstructure, temperature field simulation and mechanical property[J],MATERIALS CHARACTERIZATION,2024,215
- [3]Gao, Caihong.乔媛媛,赵宁.Effects of In addition on the properties of Sn-4Ag-0.5Cu-3Bi-0.05Ni solder[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2024,35(19)
- [4]田昕伟.乔媛媛,赵宁.陈湜,邹龙江.Suppression of Kirkendall Voids at the Interface of Sn/nc-Cu Solder Joint[A],2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2024
- [5]赖彦青.于凤云,赵宁.许睿生,陈湜,唐乾琦.Rapid formation, grain refinement and shear property of high-temperature-stable full IMC joints[J],Journal of Materials Research and Technology,24:6146-6158
- [6]Ren, X.L..刘晓英,史淑艳,王云鹏,赵宁.Morphologies and nucleus models of β-Sn grains in SAC305-xIn freestanding solder balls and solder joints[J],Materials Characterization,2024,199
- [7]Du, Yanfeng.乔媛媛,Ren, Xiaolei,赵宁.赖彦青.Characterization of Sn-xIn Solders and Thermomigration-Induced Interfacial IMC Growth of Cu/Sn-xIn/Cu Micro Solder Joints[J],ELECTRONICS,2024,12(8)
- [8]张明辉.Gao, Li-Yin,Zhang, Qi,Wang, Dawei,董伟,赵宁,Liu, Zhi-Quan.Effect of impurities on anisotropic grain growth in (111)-oriented nanotwinned copper[J],Materials Characterization,2024,214
- [9]乔媛媛.梁红伟,赵宁.Orientation transformation of Cu6Sn5 grains by Ag addition in Cu/Sn-xAg/Cu micro solder joints under temperature gradient[J],Journal of Materials Science,2024,58(11):5010-5022
- [10]Ren, Xiao-lei.王云鹏,史淑艳,刘晓英,邹龙江,赵宁.赖彦青.添加In对SAC305焊料显微组织和性能的影响[J],中国有色金属学报,2024,33(11):3427-3438