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个人信息Personal Information
教授
博士生导师
硕士生导师
主要任职：材料科学与工程学院副院长
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：材料科学与工程学院
学科：材料学
办公地点：知远楼B515(新材料大楼)
电子邮箱：zhaoning@dlut.edu.cn
扫描关注
- [1]乔媛媛, 郝泰坤, Lai, Yanqing, 梁红伟, 赵宁.Combined effect of Ag element and temperature gradient on the formation of highly orientated Sn g...[J],JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T,2024,31:2994-3002
- [2]刘笛, 白天越, 乔媛媛, 马浩然, 董伟, 赵宁.Laser jet solder ball bonding of SAC305/Cu BGA joints: Microstructure, temperature field simulati...[J],MATERIALS CHARACTERIZATION,2024,215
- [3]Gao, Caihong, 乔媛媛, 赵宁.Effects of In addition on the properties of Sn-4Ag-0.5Cu-3Bi-0.05Ni solder[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2024,35(19)
- [4]田昕伟, 陈湜, 邹龙江, 乔媛媛, 赵宁.Suppression of Kirkendall Voids at the Interface of Sn/nc-Cu Solder Joint[A],2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2024
- [5]赖彦青, 许睿生, 陈湜, 唐乾琦, 于凤云, 赵宁.Rapid formation, grain refinement and shear property of high-temperature-stable full IMC joints[J],Journal of Materials Research and Technology,24:6146-6158
- [6]Ren, X.L., 刘晓英, 史淑艳, 王云鹏, 赵宁.Morphologies and nucleus models of β-Sn grains in SAC305-xIn freestanding solder balls and solde...[J],Materials Characterization,2024,199
- [7]Du, Yanfeng, 赖彦青, 乔媛媛, Ren, Xiaolei, 赵宁.Characterization of Sn-xIn Solders and Thermomigration-Induced Interfacial IMC Growth of Cu/Sn-xI...[J],ELECTRONICS,2024,12(8)
- [8]张明辉, Gao, Li-Yin, Zhang, Qi, Wang, Dawei, 董伟, 赵宁, Liu, Zhi-Quan.Effect of impurities on anisotropic grain growth in (111)-oriented nanotwinned copper[J],Materials Characterization,2024,214
- [9]乔媛媛, 梁红伟, 赵宁.Orientation transformation of Cu6Sn5 grains by Ag addition in Cu/Sn-xAg/Cu micro solder joints un...[J],Journal of Materials Science,2024,58(11):5010-5022
- [10]Ren, Xiao-lei, 赖彦青, 王云鹏, 史淑艳, 刘晓英, 邹龙江, 赵宁.添加In对SAC305焊料显微组织和性能的影响[J],中国有色金属学报,2024,33(11):3427-3438
- [11]张明辉, Gao, Li-Yin, Wang, Yu-Xi, 董伟, 赵宁, Liu, Zhi-Quan.Micro-cones Cu fabricated by pulse electrodeposition for solderless Cu-Cu direct bonding[J],Applied Surface Science,2024,650
- [12]乔媛媛, 刘笛, 梁红伟, 赵宁.Trace of Ag atoms migration induced by temperature gradient in Cu/Sn-5.0Ag/Cu solder joints[J],Materials Characterization,2024,208
- [13]董冲, 郭世浩, 马海涛, 高朝卿, 王云鹏, 赵宁.焦耳热对Cu/Ga-21.5In-10Sn/Cu液-固电极界面微观结构的影响[J],半导体技术,2024,48(10):863-869
- [14]任晓磊, 赖彦青, 邹龙江, 王云鹏, 史淑艳, 刘晓英, 赵宁.添加In对SAC305焊料显微组织和性能的影响（英文）[J],Transactions of Nonferrous Metals Society of China,2024,33(11):3427-3438
- [15]白天越, 乔媛媛, 赵宁.Sn晶粒取向对微焊点元素迁移及界面反应的影响[J],电子与封装,2024,23(03):7-17
- [16]张明辉, 高丽茵, 刘志权, 董伟, 赵宁.先进封装铜-铜直接键合技术的研究进展[J],电子与封装,2024,23(03):58-68
- [17]赵宁, 刘晓英, 黄明亮, 马海涛.Characters of multicomponent lead-free solders[J],JOURNAL OF MATERIALS SCIENCE MATERIALS IN ELECTRONICS,2022,24(10):3925-3931
- [18]Zhong, Y., 赵宁, Liu, C. Y., 董伟, Qiao, Y. Y., 王云鹏, 马海涛.Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface ...[J],APPLIED PHYSICS LETTERS,2022,111(22)
- [19]Zhong, Yi, 赵宁, 董伟, 马海涛, 黄明亮, Yin, Luqiao, Wong, Chingping.Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compound...[J],JOURNAL OF MATERIALS RESEARCH,2022,32(16):3128-3136
- [20]Fan, M., 黄明亮, 赵宁.Cross-solder interaction on interfacial reactions in Ni/Sn-3.0Ag-0.5Cu/Cu solder interconnects[A],17th International Conference on Electronic Packaging Technology (ICEPT),2022,542-545