赵宁

个人信息Personal Information

教授

博士生导师

硕士生导师

主要任职：材料科学与工程学院副院长

性别：男

毕业院校：大连理工大学

学位：博士

所在单位：材料科学与工程学院

学科：材料学

办公地点：知远楼B515(新材料大楼)

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当前位置：赵宁的主页 >> 科学研究

研究领域

电子封装，微互连材料与技术，钎焊

论文成果 更多>>

乔媛媛.Lai, Yanqing,梁红伟,赵宁.郝泰坤.Combined effect of Ag element and temperature gradient on the formation of highly orientated Sn grains in micro solder joints[J],JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T,2024,31:2994-3002
刘笛.乔媛媛,马浩然,董伟,赵宁.白天越.Laser jet solder ball bonding of SAC305/Cu BGA joints: Microstructure, temperature field simulation and mechanical property[J],MATERIALS CHARACTERIZATION,2024,215
Gao, Caihong.乔媛媛,赵宁.Effects of In addition on the properties of Sn-4Ag-0.5Cu-3Bi-0.05Ni solder[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2024,35(19)
田昕伟.乔媛媛,赵宁.陈湜,邹龙江.Suppression of Kirkendall Voids at the Interface of Sn/nc-Cu Solder Joint[A],2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2024
赖彦青.于凤云,赵宁.许睿生,陈湜,唐乾琦.Rapid formation, grain refinement and shear property of high-temperature-stable full IMC joints[J],Journal of Materials Research and Technology,24:6146-6158
Ren, X.L..刘晓英,史淑艳,王云鹏,赵宁.Morphologies and nucleus models of β-Sn grains in SAC305-xIn freestanding solder balls and solder joints[J],Materials Characterization,2024,199

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