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论文类型： 会议论文

发表时间： 2016-08-16

收录刊物： EI、CPCI-S、SCIE、Scopus

页面范围： 273-276

关键字： Thermomigration; Sn-9Zn; Solder joint; Interfacial reaction; Intermetallic Compound

摘要： This study investigated the interfacial reaction of Ni/Sn-9Zn/Ni solder joints undergoing liquid-solid thermomigration by retlowing the solder joints on a hot plate. The simulated working temperature and temperature gradient across the liquid solder layer were about 240 degrees C and 976 degrees C/cm, respectively. Zn and Ni atoms were forced to migrate towards the cold end by temperature gradient, which resulted in the thickness of the interfacial IMCs at the cold end was larger than those at the hot end. After retlow for 60 min, the initial Ni5Zn21 IMC at the hot end was totally transformed into tau phase. However, in addition to the initial Ni5Zn21 IMC, a layer of tau phase formed at both Ni5Zn21/Ni and Ni5Zn21/solder interfaces at the cold end. The growth of the interfacial IMCs was reaction-controlled at the cold end and volume diffusion-controlled at the hot end.