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论文类型：会议论文

发表时间：2015-08-11

收录刊物：EI、CPCI-S、SCIE、Scopus

页面范围：1267-1270

关键字：Al-Cu solder joint; Sn-Zn-X solder; micrstructure; mechanical property; electrochemical corrosion behavior

摘要：Three Sn-Zn based solders were developed to join AI and Cu. The microstructure of bulk Sn-Zn based solders mainly consists of Sn-Zn-X eutectic, needle-like Zn rich solid solution and small Ni3Zn14 particles. The wettability of the Sn-Zn based solders on AI and Cu substrates is better than that of Sn-9Zn eutectic solder due to the lower surface tension of the liquid solders. In the Al/Sn-Zn-X/Cu solder joints, Al4.2Cu3.Zn-2(0.7) intermetallic compound (IMC) layer formed at the solder/Cu interface, while AI-Zn-Sn solid solutions formed at the Al/solder interface. Since all the fractures of the solder joints occurred at the AI/solder interfaces but not at the solder/Cu interfaces, the bonding strength with AI substrate determined the final strength of the whole solder joint. The 1# solder, which contains lest Zn, showed the best corrosion resistance.