赵宁

个人信息Personal Information

教授

博士生导师

硕士生导师

主要任职:材料科学与工程学院副院长

性别:男

毕业院校:大连理工大学

学位:博士

所在单位:材料科学与工程学院

学科:材料学

办公地点:知远楼B515(新材料大楼)

电子邮箱:zhaoning@dlut.edu.cn

扫描关注

论文成果

当前位置: 赵宁的主页 >> 科学研究 >> 论文成果

Effect of Sn grain orientation on Cu diffusion in SnAgCu solder interconnect undergoing electromigration

点击次数:

论文类型:会议论文

发表时间:2015-08-11

收录刊物:EI、CPCI-S、Scopus

页面范围:1275-1278

关键字:Electromigration; beta-Sn; Grain orientation; Dissolution; Intermetallic compounds

摘要:Effect of electro migration (EM) on microstructural evolution of the Cu/Sn3.0Ag0.5Cu/Cu line-type interconnect was in situ investigated. It is interesting to note that Sn grain orientation was becoming the most crucial factor to dominate the EM behavior of downsizing bumps. When the c-axis of beta-Sn grain was parallel to the electron flow direction, a larger EM flux was induced from the cathode toward the anode, resulting in the excessive dissolution of Cu occurred at the cathode and a thick Cu-Sn intermetallic compounds (IMCs) layer formed at the anode. Instead, when the c-axis of beta-Sn grain was perpendicular to the electron flow direction, EM would be retarded due to the lower Cu diffusion flux. No evident dissolution or symmetrical growth IMCs was found at either interface. The mechanism of the effect of beta-Sn grain orientation on the microstructural evolution undergoing EM was discussed from the diffusion flux point of view.