赵宁

个人信息Personal Information

教授

博士生导师

硕士生导师

主要任职:材料科学与工程学院副院长

性别:男

毕业院校:大连理工大学

学位:博士

所在单位:材料科学与工程学院

学科:材料学

办公地点:知远楼B515(新材料大楼)

电子邮箱:zhaoning@dlut.edu.cn

扫描关注

论文成果

当前位置: 赵宁的主页 >> 科学研究 >> 论文成果

Interfacial Reactions of Co-electrodeposited Eutectic Au-Sn Solder Bumps on Ni and Cu Substrates

点击次数:

论文类型:会议论文

发表时间:2013-08-11

收录刊物:EI、CPCI-S、Scopus

页面范围:225-228

关键字:co-electrodeposition; eutectic Au-30at.%Sn; solder bumps; non-cyanide; interfacial reaction

摘要:Co-electrodeposition is an economic and effective method to prepare Au-Sn solder bumps. Au-Sn solder bumps were prepared in a non-cyanide sulfite-pyrophosphate Au-Sn electroplating bath in the present work. The content of Sn in the deposited Au-Sn solder bumps was precisely controlled to be 30 at.%, i.e., Au-Sn eutectic composition. The interfacial reactions of the co-electrodeposited eutectic Au-30at.%Sn solder bumps on Cu and Ni substrates were investigated. (Ni,Au)(3)Sn-2 intermetallic compound (IMC) formed at the Au-30at.%Sn/Ni interface, while two IMC layers, i.e., (Au,Cu)(5)Sn close to the solder matrix and AuCu close to the Cu substrate, formed at the Au-30at.%Sn/Cu interface. The co-electrodeposited eutectic Au-30at.%Sn solder bumps exhibited good solderabilities on both Ni and Cu substrates.