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个人信息Personal Information
教授
博士生导师
硕士生导师
主要任职:材料科学与工程学院副院长
性别:男
毕业院校:大连理工大学
学位:博士
所在单位:材料科学与工程学院
学科:材料学
办公地点:知远楼B515(新材料大楼)
电子邮箱:zhaoning@dlut.edu.cn
Interfacial Reactions of Co-electrodeposited Eutectic Au-Sn Solder Bumps on Ni and Cu Substrates
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论文类型:会议论文
发表时间:2013-08-11
收录刊物:EI、CPCI-S、Scopus
页面范围:225-228
关键字:co-electrodeposition; eutectic Au-30at.%Sn; solder bumps; non-cyanide; interfacial reaction
摘要:Co-electrodeposition is an economic and effective method to prepare Au-Sn solder bumps. Au-Sn solder bumps were prepared in a non-cyanide sulfite-pyrophosphate Au-Sn electroplating bath in the present work. The content of Sn in the deposited Au-Sn solder bumps was precisely controlled to be 30 at.%, i.e., Au-Sn eutectic composition. The interfacial reactions of the co-electrodeposited eutectic Au-30at.%Sn solder bumps on Cu and Ni substrates were investigated. (Ni,Au)(3)Sn-2 intermetallic compound (IMC) formed at the Au-30at.%Sn/Ni interface, while two IMC layers, i.e., (Au,Cu)(5)Sn close to the solder matrix and AuCu close to the Cu substrate, formed at the Au-30at.%Sn/Cu interface. The co-electrodeposited eutectic Au-30at.%Sn solder bumps exhibited good solderabilities on both Ni and Cu substrates.