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论文类型： 期刊论文

发表时间： 2018-01-01

发表刊物： MICROELECTRONICS RELIABILITY

收录刊物： SCIE、EI

卷号： 80

页面范围： 55-67

ISSN号： 0026-2714

关键字： Enthalpy; Finite element method; Intermetallic compound; Laser soldering; Diffusion; Scan speed

摘要： The magnitudes of input power and scan speed of laser heat source can affect the morphology and size of interfacial Cu6Sn5 intermetallic compound (IMC) formed or grown in Sn/Cu and Sn-3.5Ag-0.5Cu/Cu (SAC/Cu) joints. Experimentally, it has been observed that greater power and smaller scan speed can create temperature field of higher magnitude, thereby enhancing the interfacial reaction. The occurrence of conglomerated, prismatic (faceted) and scalloped IMC morphologies in the specimens corresponding to designated laser processing parameters, has been explained with the help of Jackson parameter. The heat and mass transfer phenomena during laser soldering, is modeled using finite element analysis. Enthalpy method is applied in the FEM based computational model to describe the phase change based heat transfer at the melting regime of the solder. With an attainment of transient temperature profiles at several scan speeds through the numerical analysis, the values of interfacial reaction temperature at solder/substrate interface and diffusion phenomenon based mass transfer of Cu into solder are then utilized to explain the experimental results of IMC size. In comparison to pure Sn solder, SAC solder type is characterized with the formation of thicker IMC at laser power of 50 W and scan speeds below 180 mm/min.