赵宁

个人信息Personal Information

教授

博士生导师

硕士生导师

主要任职:材料科学与工程学院副院长

性别:男

毕业院校:大连理工大学

学位:博士

所在单位:材料科学与工程学院

学科:材料学

办公地点:知远楼B515(新材料大楼)

电子邮箱:zhaoning@dlut.edu.cn

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In situ study on dissolution and growth mechanism of interfacial Cu6Sn5 in wetting reaction

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论文类型:期刊论文

发表时间:2015-01-15

发表刊物:MATERIALS LETTERS

收录刊物:SCIE、EI、Scopus

卷号:139

页面范围:42-45

ISSN号:0167-577X

关键字:Synchrotron radiation; Crystal growth; Intermetallic alloys and compounds; Precipitation; Dissolution; Cu6Sn5

摘要:Synchrotron radiation real-time imaging technology was used for in situ study of dissolution and growth behavior of interfacial Cu6Sn5 intermetallic compound (IMC) in Sn/Cu solder interconnect during reflow soldering. The pre-formed Cu6Sn5 grains dissolved into the liquid solder with decreasing aspect ratio in the heating stage, maintained a thin layer of scallop-type in the dwelling stage, and re-precipitated on the existing Cu6Sn5 grains at a faster growth rate with increasing aspect ratio in the cooling stage. The Cu concentration gradient at the interface is responsible for the aspect ratio variation (corresponding to dissolution and re-precipitation of interfacial Cu6Sn5 grains), which is also supported by the simulation of atomic diffusion in the solder based on Fick's second law. The growth behavior was well explained by a proposed model based on the Cu concentration gradient. (C) 2014 Elsevier B.V. All rights reserved