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个人信息Personal Information
教授
博士生导师
硕士生导师
主要任职:材料科学与工程学院副院长
性别:男
毕业院校:大连理工大学
学位:博士
所在单位:材料科学与工程学院
学科:材料学
办公地点:知远楼B515(新材料大楼)
电子邮箱:zhaoning@dlut.edu.cn
In situ study on dissolution and growth mechanism of interfacial Cu6Sn5 in wetting reaction
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论文类型:期刊论文
发表时间:2015-01-15
发表刊物:MATERIALS LETTERS
收录刊物:SCIE、EI、Scopus
卷号:139
页面范围:42-45
ISSN号:0167-577X
关键字:Synchrotron radiation; Crystal growth; Intermetallic alloys and compounds; Precipitation; Dissolution; Cu6Sn5
摘要:Synchrotron radiation real-time imaging technology was used for in situ study of dissolution and growth behavior of interfacial Cu6Sn5 intermetallic compound (IMC) in Sn/Cu solder interconnect during reflow soldering. The pre-formed Cu6Sn5 grains dissolved into the liquid solder with decreasing aspect ratio in the heating stage, maintained a thin layer of scallop-type in the dwelling stage, and re-precipitated on the existing Cu6Sn5 grains at a faster growth rate with increasing aspect ratio in the cooling stage. The Cu concentration gradient at the interface is responsible for the aspect ratio variation (corresponding to dissolution and re-precipitation of interfacial Cu6Sn5 grains), which is also supported by the simulation of atomic diffusion in the solder based on Fick's second law. The growth behavior was well explained by a proposed model based on the Cu concentration gradient. (C) 2014 Elsevier B.V. All rights reserved