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论文类型： 期刊论文

发表时间： 2009-04-01

发表刊物： RARE METAL MATERIALS AND ENGINEERING

收录刊物： SCIE、PKU、ISTIC

卷号： 38

页面范围： 107-111

ISSN号： 1002-185X

关键字： multicomponent lead-free solder; Sn-Cu; DSC; tensile property; interfacial reaction

摘要： The melting behavior, microstructure, tensile property and interfacial reactions with Ni substrates of two multicomponent solders, namely Sn-2Cu-0.5Ni (SC-Ni) and Sn-2Cu-0.5Ni-0.5Au (SC-NiAu) were studied. Results show that the addition of Au decreases the melting point of SC-NiAu alloy. The intermetallic compounds (IMC) of the two solders formed in the matrixes are both based on Cu(6)Sn(5) structure. After soldered with Ni substrate at 260 degrees C for 60 s, stick-like (Cu,Ni)(6)Sn(5) IMC are found at SC-Ni/Ni and SC-NiAu/Isli interfaces. The tensile strength and elongation percentage are obtained by tensile tests, and comparisons are made with eutectic Sn-0.7Cu alloy.