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个人信息Personal Information
教授
博士生导师
硕士生导师
主要任职：材料科学与工程学院副院长
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：材料科学与工程学院
学科：材料学
办公地点：知远楼B515(新材料大楼)
电子邮箱：zhaoning@dlut.edu.cn
Microstructure, Mechanical Property and Interfacial Reaction of Sn-Cu Based Multicomponent Lead-Free Solders
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论文类型：期刊论文
发表时间：2009-04-01
发表刊物：RARE METAL MATERIALS AND ENGINEERING
收录刊物：SCIE、PKU、ISTIC
卷号：38
页面范围：107-111
ISSN号：1002-185X
关键字：multicomponent lead-free solder; Sn-Cu; DSC; tensile property; interfacial reaction
摘要：The melting behavior, microstructure, tensile property and interfacial reactions with Ni substrates of two multicomponent solders, namely Sn-2Cu-0.5Ni (SC-Ni) and Sn-2Cu-0.5Ni-0.5Au (SC-NiAu) were studied. Results show that the addition of Au decreases the melting point of SC-NiAu alloy. The intermetallic compounds (IMC) of the two solders formed in the matrixes are both based on Cu(6)Sn(5) structure. After soldered with Ni substrate at 260 degrees C for 60 s, stick-like (Cu,Ni)(6)Sn(5) IMC are found at SC-Ni/Ni and SC-NiAu/Isli interfaces. The tensile strength and elongation percentage are obtained by tensile tests, and comparisons are made with eutectic Sn-0.7Cu alloy.