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论文类型：会议论文

发表时间：2013-12-11

收录刊物：EI、Scopus

页面范围：510-515

摘要：This paper presents a system in package (SiP) application of integrated passive device (IPD) filters based on silicon substrate. Four kinds of IPD filters, mainly constructed with planar spiral inductors and metal-insulator-metal (MIM) capacitors, were designed and integrated. Moreover, the process flow is detailed described. Through comparison between simulation results and experiment results, thick Cu metal layer together with BCB dielectric material is proved to be a proper approach to modify filter's Q factor. ? 2013 IEEE.