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论文类型：会议论文

发表时间：2006-01-01

收录刊物：CPCI-S

页面范围：317-322

关键字：chemical mechanical polishing; organic alkali; copper; material removal rate

摘要：In this paper, an experimental study is presented, in which 3 kinds of organic alkalis are used as the complexing agent, a silica sol is used as the abrasive and H2O2 is used as the oxidizer respectively. After mixing them orderly, a series of polishing experiments are conducted under the same process parameters. The results of experiment indicate that, the complexation effect of the organic alkali containing 2 amidogen is very obvious, with the maximal removal rate for copper reaching 850.8nm/min and the roughness of surface Ra=13.540 angstrom, the removal rate of another two kinds of organic alkalis is much lower relatively, with the maximal removal rate being only 71.8 nm/min and 25.1 nm./min, respectively, in the experiment. It could be known that the organic alkali containing 2 amidogen is suited to ULSI copper polishing slurry under alkaline condition. The reason for higher material removal rate is that the effective complexation action can match the polishing process parameters as well as the dynamic balance between the chemical action and the mechanical action.