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论文类型：期刊论文

发表时间：2006-01-01

发表刊物：8th Conference on Machining and Advanced Manufacturing Technology in China

收录刊物：SCIE、CPCI-S、Scopus

卷号：315-316

页面范围：775-778

ISSN号：1013-9826

关键字：CMP; suspending abrasive; porous pad

摘要：The lubrication properties of the slurry between the silicon wafer and the pad in chemical mechanical polishing (CMP) are critical to the planarity of the silicon wafer. The effects of porous pad and suspending abrasives on the slurry film beneath the wafer become more prominent as the size of the silicon wafer becomes bigger. In order to explore the effects of porous pad and suspending abrasives on the lubrication properties of the slurry, a three-dimensional lubrication model based on the micropolar fluid theory and Darcy's law is developed. The effects of the nanometer abrasives and the porosity of the pad on the lubrication of the slurry film between the silicon wafer and the pad are discussed.