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发布时间：2019-03-09

论文类型：期刊论文

发表时间：2011-02-07

发表刊物：APPLIED PHYSICS LETTERS

收录刊物：EI、SCIE、Scopus

卷号：98

期号：6

ISSN号：0003-6951

摘要：One important aspect of stretchable electronics design is to shield the active devices from strains through insertion of a soft layer between devices and substrate. An analytical model is established, which gives linear dependence of strain isolation on the reciprocal of strain-isolation layer thickness, and the reciprocal of device and substrate stiffness. Strain isolation is also linearly proportional to the shear modulus of strain-isolation layer and square of device length. (C) 2011 American Institute of Physics. [doi:10.1063/1.3553020]