点击次数：

论文类型：期刊论文

发表时间：2010-12-01

发表刊物：ACTA MECHANICA SOLIDA SINICA

收录刊物：SCIE、EI、Scopus

卷号：23

期号：6,1

页面范围：592-599

ISSN号：0894-9166

关键字：stretchable electronics; shell; soft materials

摘要：Various methods have been developed to fabricate highly stretchable electronics. Recent studies show that over 100% two dimensional stretchability can be achieved by mesh structure of brittle functioning devices interconnected with serpentine bridges. Kim et al show that pressing down an inflated elastomeric thin film during transfer printing introduces two dimensional prestrain, and therefore further improves the system stretchability. This paper gives a theoretical study of this process, through both analytical and numerical approaches. Simple analytical solutions are obtained for meridional and circumferential strains in the thin film, as well as the maximum strain in device islands, which all agree reasonably well with finite element analysis.