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发布时间：2019-03-13

论文类型：期刊论文

发表时间：2016-01-27

发表刊物：JOURNAL OF PHYSICS D-APPLIED PHYSICS

收录刊物：Scopus、EI、SCIE

卷号：49

期号：3

ISSN号：0022-3727

关键字：electrical resistivity; cluster-plus-glue-atom model; short-range order; Cu alloys; ternary alloys

摘要：The electrical resistivity of metallic alloys is known to be largely affected by chemical short-range ordering. In accordance with the cluster-plus-glue-atom model for solid solutions, the present paper interpreted the composition versus resistivity behavior of Cu-Ni-Mo ternary alloys. The presence of Mo-centered [Mo-Ni-12] nearest-neighbor clusters is assumed, as the result of the negative enthalpy of mixing between Mo and Ni. The residual electrical resistivities are then correlated to the scattering from the [Mo-Ni-12] clusters, plus that from extra Ni solutes in solution with Cu for Mo/Ni < 1/12 or from Mo precipitates for Mo/Ni > 1/12. Such a cluster-based mechanism explains perfectly the experimental resistivity data, with the additional resistivities from the cluster, Ni solute, and Mo precipitate being, respectively, 1.08, 1.21, and 0.09 ( 10(-8) Omega m). The present work provides a simple method for the electrical resistivity manipulation of metallic alloys.