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个人信息Personal Information
教授
博士生导师
硕士生导师
性别:男
毕业院校:德国卡尔斯鲁厄工业大学
学位:博士
所在单位:材料科学与工程学院
学科:材料物理与化学. 微电子学与固体电子学
办公地点:辽宁省大连市高新园区凌工路2号
大连理工大学新三束实验室412
电子邮箱:
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- [1]习 娟.周大雨.吕天明.高Sc掺杂AlN薄膜铁电性能的研究[J],功能材料与器件学报,2024,30(05):239-246
- [2]王梦晓.周大雨.赵文瑾,史淑艳,Xu, Jin,Su, Yunpeng,Gu, Jiaye,孙纳纳.Long-term stability of electrical and electrochemical properties of TiN film in the atmosphere environment[J],SURFACES AND INTERFACES,2025,61
- [3]隋金洋.周大雨.Tong, Yi,Wang, Xinpeng,赵文瑾,赵泳淞.Thermal residual stress-dependent coercive field and polarization switching dynamics of Al0.75Sc0.25N ferroelectric films[J],MATERIALS TODAY COMMUNICATIONS,2025,44
- [4].Zhou, Dayu.周大雨,Xu, Jin,Su, Yunpeng,Gu, Jiaye,孙纳纳.Enhanced capacitive performance and stability of on-chip micro-supercapacitor electrode films via TiN-Mo2N alloying and laminating strategies[J],CHEMICAL ENGINEERING JOURNAL,2025,505
- [5].Zhou, Dayu.周大雨.Tuning the structural and electrical properties of TiNx thin films with low temperature coefficient of resistance[J],APPLIED SURFACE SCIENCE,2025,706
- [6].Zhou, Dayu.Tang, Zhen,Sun, Yue,Niu, Chunjie,Yang, Jichi,周大雨.Comparative study on the influence mechanism of He/Ar/N2 plasma treatments on the high tensile stress of a multilayer silicon nitride film[J],RSC ADVANCES,2025,15(23):17875-17884
- [7].Zhou, Dayu.周大雨.Titanium molybdenum nitride/titanium nitride laminated films prepared by a high-throughput method for on-chip microsupercapacitors[J],ELECTROCHIMICA ACTA,2025,514
- [8].Zhou, Dayu.Niu, Chunjie,Tang, Zhen,Sun, Yue,Yan, Hao,周大雨.Optimizing the PECVD Process for Stress-Controlled Silicon Nitride Films: Enhancement of Tensile Stress via UV Curing and Layered Deposition[J],COATINGS,2025,15(6)
- [9].Zhou, Dayu.周大雨,Tong, Yi,Wang, Xinpeng.Demonstration of ferroelectricity in Zn1-xMgxO thin films over a wide Mg concentration range[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2025,36(18)
- [10].Yao Man, Zhou Dayu.Tong Yi,Wang Xinpeng,王旭东,周大雨,姚曼.Key factors of spontaneous polarization magnitude in wurtzite materials[J],ACTA PHYSICA SINICA,2025,74(2)
