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发布时间：2019-03-09

论文类型：期刊论文

发表时间：2015-11-01

发表刊物：ENVIRONMENTAL SCIENCE AND POLLUTION RESEARCH

收录刊物：Scopus、PubMed、SCIE

卷号：22

期号：22

页面范围：17683-17690

ISSN号：0944-1344

关键字：Electronic solder; ICP-MS; Acidified soil; Leaching

摘要：The leaching behaviour of Sn and Pb elements from eutectic SnPb solder of electronic waste in acidic soil was investigated through acidification with HCl-H2SO4 solution and compared with saline solution. The amounts of Sn and Pb elements leached, when subjected to acidic soil, are higher than those with saline soil. Evidence for the significantly preferential release of Sn into the leachate is provided; the galvanic couple accelerated such preferential release. Surface product analysis reveals the slight damage of SnPb in saline soil. Serious dissolution due to electrochemical reaction and a thick, porous PbSO4 surface layer are observed in acidified soil, suggesting more severe toxicity potential of Pb in soil rather than in water.