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Degree:Doctoral Degree
School/Department:机械工程学院

Discipline:Mechanical Manufacture and Automation

zhuxianglong

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Gender:Male

Alma Mater:大连理工大学

Paper Publications

A novel piezoelectric grinding dynamometer for monitoring ultra-precision grinding of silicon wafers
Release Time:2019-03-11  Hits:

Indexed by:Journal Article
Date of Publication:2010-09-19
Journal:Advanced Materials Research
Included Journals:Scopus、CPCI-S、EI
Volume:126-128
Page Number:707-712
ISSN:9780878492428
Key Words:silicon wafers; grinder; quartz crystal; piezoelectric effect; grinding dynamometer
Abstract:This paper presents a novel piezoelectric grinding dynamometer, aiming at the detecting demand of grinding force in the process of ultra-precision grinding. Grinder structure and interaction force distribution between grinding wheel and silicon wafers are considered. The working principle and structure of dynamometer are analyzed. The distribution of force sensors is designed. The static and dynamic calibration experiments and on-line grinding tests are carried out in the dynamometer. The working range of F(z) is +/- 1500N, both F(x) and F(y)), are +/- 600N. The linearities of F(x), F(y) and F(z) are more than 99.7%, the repeatabilities are more than 99%, and the crosstalks are all less than 3%. The natural frequency of F(z) is 1616 Hz, F(x) is 2383 Hz and F(y) is 2490 Hz. The dynamometer using piezoelectric effect has advantages of high sensitivity, good linearity and repeatability, simple structure, low cost, easy assembling and debugging. The results of experiments and tests reach the CIRP criteria and the working demands for the ultra-precision grinder.