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Degree:Doctoral Degree
School/Department:机械工程学院

zhuxianglong

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Gender:Male

Alma Mater:大连理工大学

Paper Publications

Research on topography control of two-spindle and three-workstation wafer grinder
Date of Publication:2011-09-01 Hits:

Indexed by:期刊论文
Journal:PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART C-JOURNAL OF MECHANICAL ENGINEERING SCIENCE
Included Journals:Scopus、SCIE、EI
Volume:225
Issue:C9
Page Number:2232-2241
ISSN No.:0954-4062
Key Words:grinder; chuck topography; silicon wafer; chuck dressing; modelling
Abstract:Silicon wafers are widely used in integrated circuits. This article addresses an important aspect of flat wafer grinding: grinder design. An advanced grinder with two-spindle and three-workstation for empty set300 mm silicon wafer based on the principles of in-feed grinding was successfully developed. A mathematical model on topography control was developed for the first time to provide a totally integrated solution for dressing chuck with given topography. The developed model was then applied to predict the chuck topography or to adjust the obliquity adjustment device according to the parameters of ground chuck. Finally, the pilot experiments on two groups of chucks, which demonstrate the correctness of topography control are included.
Date of Publication:2011-09-01