大连理工大学主页平台管理系统 zhuxianglong Surface integrity and removal mechanism of silicon wafers in chemo-mechanical grinding using a newly developed soft abrasive grinding wheel Home

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Degree:Doctoral Degree
School/Department:机械工程学院

Discipline:Mechanical Manufacture and Automation

Gender:Male

Alma Mater:大连理工大学

Current position: Home / Scientific Research / Paper Publications

Surface integrity and removal mechanism of silicon wafers in chemo-mechanical grinding using a newly developed soft abrasive grinding wheel

Release Time:2022-10-17 Hits:

Date of Publication:2022-10-09
Journal:MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
Institution:机械工程学院
Volume:63
Page Number:97-106
ISSN:1369-8001