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Degree:Doctoral Degree
School/Department:机械工程学院

DALIAN UNIVERSITY OF TECHNOLOGY      Login     

zhuxianglong

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Gender:Male

Alma Mater:大连理工大学

Paper Publications

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Surface integrity and removal mechanism of silicon wafers in chemo-mechanical grinding using a newly developed soft abrasive grinding wheel
Date of Publication:2022-10-09 Hits:

Journal:MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
Affiliation of Author(s):机械工程学院
Volume:63
Page Number:97-106
ISSN No.:1369-8001
Date of Publication:2022-10-09

Pre One:Surface and subsurface integrity of glass-ceramics induced by ultra-precision grinding

Next One:Surface shape control of the workpiece in a double-spindle triple-workstation wafer grinder

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