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Degree:Doctoral Degree
School/Department:机械工程学院

Discipline:Mechanical Manufacture and Automation

DALIAN UNIVERSITY OF TECHNOLOGY      Login     

zhuxianglong

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Gender:Male

Alma Mater:大连理工大学

Paper Publications

Current position: Home / Scientific Research / Paper Publications
Effect of grinding residual height on the surface shape of ground wafer
Release Time:2022-10-17  Hits:

Date of Publication:2022-10-02
Journal:JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Volume:299
ISSN:0924-0136
Key Words:"Silicon wafer; Residual height; Grinding marks; Wafer shape; Model"

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