Date of Publication:2022-10-02
Journal:19th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2019
Page Number:432-435
zhuxianglong
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Gender:Male
Alma Mater:大连理工大学
Paper Publications
Double-sided lapping of thin copper substrate by textured fixed-abrasive pad
Release Time:2022-10-17 Hits: