Release Time:2024-07-18 Hits:
Indexed by:Journal Papers
Document Code:374262
Date of Publication:2023-01-15
Journal:微纳电子技术
Volume:60
Issue:01
Page Number:159-164
ISSN:1671-4776
Key Words:chemical mechanical polishing(CMP); flatness; process optimization; quartz wafer; surface roughness
CN:13-1314/TN