Journal:Measurement: Journal of the International Measurement Confederation
Volume:234
ISSN No.:0263-2241
Key Words:Error modeling; Errors; Functional points; Grinding (machining); Homogeneous transformation matrix; Linear transformations; Precision grinding machines; Silicon wafers; Surface topography; Surface topography prediction; Thinnings; Topography; Ultraprecision grinding; Volumetric errors; Wafer surface; Wafer surface quality
Date of Publication:2024-05-21
zhuxianglong
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Gender:Male
Alma Mater:大连理工大学
Paper Publications
Model for surface topography prediction in the ultra-precision grinding of silicon wafers considering volumetric errors
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