Release Time:2024-07-18 Hits:
Date of Publication:2024-05-21
Journal:Measurement: Journal of the International Measurement Confederation
Volume:234
ISSN:0263-2241
Key Words:Error modeling; Errors; Functional points; Grinding (machining); Homogeneous transformation matrix; Linear transformations; Precision grinding machines; Silicon wafers; Surface topography; Surface topography prediction; Thinnings; Topography; Ultraprecision grinding; Volumetric errors; Wafer surface; Wafer surface quality