Personal Homepage

Personal Information

MORE+

Degree:Doctoral Degree
School/Department:机械工程学院

Discipline:Mechanical Manufacture and Automation

DALIAN UNIVERSITY OF TECHNOLOGY      Login     

zhuxianglong

+

Gender:Male

Alma Mater:大连理工大学

Paper Publications

Current position: Home / Scientific Research / Paper Publications
Simulation modeling of wafer grinding surface roughness considering grinding vibration
Release Time:2024-12-04  Hits:

Date of Publication:2024-11-02
Journal:Precision Engineering
ISSN:0141-6359
Key Words:Dynamics model; Grinding force; Iterative method; Vibration equation; Wafer precision grinding; Workpiece rotation method

Prev One:Simulation modeling of wafer grinding surface roughness considering grinding vibration

Next One:基于有限元模拟的螺栓退刀槽滚压轮优化及试验研究

  • Click:
  • MOBILE Version

The Last Update Time:..

Open Time:..

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024