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Degree:Doctoral Degree
School/Department:机械工程学院

DALIAN UNIVERSITY OF TECHNOLOGY      Login     

zhuxianglong

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Gender:Male

Alma Mater:大连理工大学

Paper Publications

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Simulation modeling of wafer grinding surface roughness considering grinding vibration
Date of Publication:2024-11-02 Hits:

Journal:Precision Engineering
ISSN No.:0141-6359
Key Words:Dynamics model; Grinding force; Iterative method; Vibration equation; Wafer precision grinding; Workpiece rotation method
Date of Publication:2024-11-02

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