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Degree:Doctoral Degree
School/Department:机械工程学院

DALIAN UNIVERSITY OF TECHNOLOGY      Login     

zhuxianglong

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Gender:Male

Alma Mater:大连理工大学

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Simulation modeling of wafer grinding surface roughness considering grinding vibration
Date of Publication:2024-10-31 Hits:

Journal:PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
Volume:91
Page Number:278-289
ISSN No.:0141-6359
Key Words:GRAIN; SPINDLE VIBRATION; TOPOGRAPHY
Date of Publication:2024-10-31

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