赵宁

Professor   Supervisor of Doctorate Candidates   Supervisor of Master's Candidates

Main positions:材料科学与工程学院副院长

Gender:Male

Alma Mater:Dalian University of Technology

Degree:Doctoral Degree

School/Department:School of Materials Science and Engineering

Discipline:Materials Science

E-Mail:zhaoning@dlut.edu.cn


Paper Publications

The morphology variation of IMC on the solder/bubble interface under different cooling rates and temperatures

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Indexed by:会议论文

Date of Publication:2016-08-16

Included Journals:EI、CPCI-S、Scopus

Page Number:425-428

Key Words:bubbles; cooling rate; gas/solid interface; intermetallic compounds; growth orientation; diffusion; SEM

Abstract:As bubbles on the solder/copper interface can seriously decrease the joint reliability of lead-free soldering in electronic packaging industry, the research of interfacial bubbles is extremely imperative. In the local area around an interfacial bubble, the Cu atoms tend to migrate towards the gas/solid interface, providing the copper element to form the interfacial intermetallic compounds (IMCs). Because of the different thermal conductivity inside and outside the void (inside gas lower than outside solid), the bubble interface will have a disparate temperature gradient comparing with the solid area around the bubble. Based on this, the morphology variation of IMCs on the solder/bubble interface under various soldering temperatures and cooling rates was investigated in this study, using the scanning electron microscope (SEM) for the cross section each time after the soldering reaction part carried out in furnace with the soldering temperature of 250 degrees C, 300 degrees C, 350 degrees C and holding time of 60s, followed by water, air, furnace cooling (WC, AC, FC). It was found that, IMCs are much more easily to exist on the bubble interface, especially the position including some small holes due to the higher concentration of metal atoms brought by them; On the other hand, most of the bubble interface will have no well-formed IMCs if no small voids sticking to when the cooling rate is high. In a certain soldering temperature, with the cooling rate declining (WC>AC>FC), the morphology of the interfacial IMCs gradually change from solid to hollow structure due to different growth rates of two vertical growing orientation inside the new formed phase. In addition, when the soldering temperature improved, the volume ratio of the cavity part in the hollow structure will reduce gradually.

Pre One:Positive Feedback on Imposed Thermal Gradient by Interfacial Bubbles in Cu/liquid Sn-3.5Ag/Cu Joints

Next One:Microstructure and interfacial reactions of Sn-Au-Ag solder joints on Cu and Ni substrates

Profile

赵宁,工学博士,教授,博士生导师,现任材料科学与工程学院副院长。《Scientific Reports》期刊编委,IEEE会员、IEEE-EPS会员,中国电子学会(电子制造与封装技术分会)、中国材料研究学会、中国机械工程学会高级会员。

2003年本科毕业于东北大学材料物理专业,2008年博士毕业于大连理工大学材料学专业。2009年至2011年在中科院微电子研究所系统封装技术研究室从事博士后研究,2011年加入大连理工大学材料学院,同年评为副教授,2017年评为博士生导师,2018年评为教授。2016年至2017年在美国佐治亚理工学院做访问学者,合作学者为美国工程院院士、中国工程院外籍院士C.P. Wong教授。

主要从事电子封装微互连材料与技术的基础理论及应用研究,重点围绕微互连方法与成型机理,微焊点晶粒生长调控、组织演变、热迁移行为与可靠性测试分析,晶圆级互连技术,无铅焊料及BGA焊球开发与组织控制,低电阻率电镀铜膜/线等方面开展深入研究。

主持国家自然科学基金(4项)、省部级科研项目十余项,参与多项国家科技重大专项等项目。在Acta Mater.、Mater. Des.、J. Mater. Sci. Tech.、Appl. Phys. Lett.、Scripta Mater.、J. Mater. Process. Tech.、Sci. Rep.、J. Alloys Compd.、Appl. Surf. Sci.、Mater. Charact.、Intermetallics、Mater. Res. Bull.、J. Appl. Phys.、Mater. Lett.、Mater. Chem. Phys.、J. Mater. Res.、J. Electron. Mater.、物理学报、金属学报、中国有色金属学报(英文版)、稀有金属材料与工程等期刊上发表学术论文100余篇;在ECTC、ICEPT、CSTIC、EPTC等国际学术会议上发表EI论文60余篇,5次获得最佳论文奖;获中国发明专利授权25项。入选辽宁省“百千万人才工程”、大连市高层次人才计划。

指导学生:

在读硕士生11人,博士生6人。

已毕业博士生3、硕士生15人。

指导研究生多次获得国家奖学金、省优秀毕业生、市三好学生、校优秀博士/硕士研究生、优秀学位论文等荣誉。

 

欢迎有意从事微电子制造、微电子封装行业,具有材料、机械、物理、微电子专业背景,勤奋好学、积极乐观的学子们加入本课题组!