赵宁
Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Main positions:材料科学与工程学院副院长
Gender:Male
Alma Mater:Dalian University of Technology
Degree:Doctoral Degree
School/Department:School of Materials Science and Engineering
Discipline:Materials Science
E-Mail:zhaoning@dlut.edu.cn
Hits:
Indexed by:期刊论文
Date of Publication:2017-04-01
Journal:JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Included Journals:SCIE、EI
Volume:28
Issue:7
Page Number:5398-5406
ISSN No.:0957-4522
Abstract:The morphology evolution mechanism and dynamics of Cu6Sn5 intermetallic compound (IMC) in cooling stage were studied by using pure Sn solder ball with a diameter of 1 mm to react with polycrystalline Cu substrate and form Cu6Sn5. A nearly uniform height of the scallop-like IMC grains is attained by using high pressurized air to remove excess liquid solder (that is, for acquisition of the IMC morphology identical to heat preservation stage). But the morphology evolution of IMC in the solder joint was greatly affected by the cooling phase of interfacial reaction, and IMC morphology partition phenomenon was found in the spherical joints. The IMC at the edge portion characterized scallop morphology whereas the central portion possessed prismatic shape morphology. Finite element simulation for the temperature field distribution in the solder ball-substrate domain showed temperature gradient in solder's internal core was significantly greater than that at the edge. Using this simulation results with kinetic equations, it could be understood that the central core region is conducive to the formation of small plane structure morphology. These small planes would eventually form the prismatic morphology IMC in the central region. As the soldering temperature increases, the area ratio of IMC with scallop-like morphology to the prismatic shaped IMC reduced from 0.2178 down to 0.1680. Moreover, for an elevated temperature of 300 A degrees C, it is observed that the central region IMC (with prismatic structure) grows upto an average thickness of 7.7245 mu m, whereas the thickness value for scalloped IMC at the edge portion is around 4.556 mu m.
赵宁,工学博士,教授,博士生导师,现任材料科学与工程学院副院长。《Scientific Reports》期刊编委,IEEE会员、IEEE-EPS会员,中国电子学会(电子制造与封装技术分会)、中国材料研究学会、中国机械工程学会高级会员。
2003年本科毕业于东北大学材料物理专业,2008年博士毕业于大连理工大学材料学专业。2009年至2011年在中科院微电子研究所系统封装技术研究室从事博士后研究,2011年加入大连理工大学材料学院,同年评为副教授,2017年评为博士生导师,2018年评为教授。2016年至2017年在美国佐治亚理工学院做访问学者,合作学者为美国工程院院士、中国工程院外籍院士C.P. Wong教授。
主要从事电子封装微互连材料与技术的基础理论及应用研究,重点围绕微互连方法与成型机理,微焊点晶粒生长调控、组织演变、热迁移行为与可靠性测试分析,晶圆级互连技术,无铅焊料及BGA焊球开发与组织控制,低电阻率电镀铜膜/线等方面开展深入研究。
主持国家自然科学基金(4项)、省部级科研项目十余项,参与多项国家科技重大专项等项目。在Acta Mater.、Mater. Des.、J. Mater. Sci. Tech.、Appl. Phys. Lett.、Scripta Mater.、J. Mater. Process. Tech.、Sci. Rep.、J. Alloys Compd.、Appl. Surf. Sci.、Mater. Charact.、Intermetallics、Mater. Res. Bull.、J. Appl. Phys.、Mater. Lett.、Mater. Chem. Phys.、J. Mater. Res.、J. Electron. Mater.、物理学报、金属学报、中国有色金属学报(英文版)、稀有金属材料与工程等期刊上发表学术论文100余篇;在ECTC、ICEPT、CSTIC、EPTC等国际学术会议上发表EI论文60余篇,5次获得最佳论文奖;获中国发明专利授权25项。入选辽宁省“百千万人才工程”、大连市高层次人才计划。
指导学生:
在读硕士生11人,博士生6人。
已毕业博士生3、硕士生15人。
指导研究生多次获得国家奖学金、省优秀毕业生、市三好学生、校优秀博士/硕士研究生、优秀学位论文等荣誉。
欢迎有意从事微电子制造、微电子封装行业,具有材料、机械、物理、微电子专业背景,勤奋好学、积极乐观的学子们加入本课题组!