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论文类型：期刊论文

发表时间：2017-05-01

发表刊物：3rd International Conference of Smart Systems Engineering (SmaSys)

收录刊物：SCIE、EI、CPCI-S

卷号：23

期号：5,SI

页面范围：1327-1333

ISSN号：0946-7076

摘要：In this work, a thermal bonding method based on O-2 plasma and water treatment was proposed to address the high dimension loss and low bonding strength issue during plastic planar nanofluidic device fabrication process. By this method, the PET (polyethylene terephthalate) planar nanofluidic device could be bonded at low temperature of 60 A degrees C, force of 100 N and time of 15 min. To decrease the dimension loss and increase the bonding strength, thermal bonding parameters were optimized. The tensile test showed that the bonding strength of the PET planar nanofluidic device could be as high as 288.1 N. The fluorescence dye filling test indicated that there was no leakage and block in the PET planar nanofluidic device.