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论文类型：期刊论文

发表时间：2018-01-01

发表刊物：JOURNAL OF ELECTRICAL ENGINEERING-ELEKTROTECHNICKY CASOPIS

收录刊物：SCIE

卷号：69

期号：1

页面范围：72-78

ISSN号：1335-3632

关键字：microfluidic chip; tape assist bonding; numerical simulation

摘要：With the development of the microstructure fabrication technique, microfluidic chips are widely used in biological and medical researchers. Future advances in their commercial applications depend on the mass bonding of microfluidic chip. In this study we are presenting a simple, low cost and fast way of bonding microfluidic chips at room temperature. The influence of the bonding pressure on the deformation of the microchannel and adhesive tape was analyzed by numerical simulation. By this method, the microfluidic chip can be fully sealed at low temperature and pressure without using any equipment. The dye water and gas leakage test indicated that the microfluidic chip can be bonded without leakage or block and its bonding strength can up to 0.84 MPa.