高尚
个人信息Personal Information
教授
博士生导师
硕士生导师
性别:男
毕业院校:大连理工大学
学位:博士
所在单位:机械工程学院
学科:机械制造及其自动化
办公地点:机械工程学院高性能制造研究所#5015室
联系方式:手机:15104088992
电子邮箱:gaoshang@dlut.edu.cn
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- [21]高尚, 郭晓光, 董志刚, 康仁科.新工科背景下研究型教学模式探索与实践——以精密加工课程为例[J],教育信息化论坛,2024,01:3-5
- [22]高尚, 杨鑫, 任佳伟, 郭晓光, 康仁科.Abrasive machining induced surface layer damage behavior and formation mechanism of monocrystalli...[J],Materials Characterization,2024,206
- [23]耿大彦, 祁永年, 王崇昆, 郭晓光, 高尚, 康仁科.Computational analysis of electronic structure and optical properties of monocrystalline silicon-...[J],Materials Today Communications,2024,38
- [24]邓曰明, 郭晓光, Wang, Hao, Yuan, Song, 刘巍, 康仁科, 高尚.Atomic understanding of the evolutionary mechanism of fused glass densification generation during...[J],Journal of Materials Research and Technology,2024,28:43-52
- [25]沈煜, 王浩祥, 郭晓光, 高尚.Environment-friendly chemical mechanical polishing using NaHCO3-activated H2O2 slurry for highly ...[J],Journal of Manufacturing Processes,2024,109:213-221
- [26]敖萌灿, 黄金星, Zeng, Yuxian, Wu, Yueqin, 康仁科, 高尚.超精密磨削 YAG 晶体的脆塑转变临界深度预测[J],Optics and Precision Engineering,2024,1:84-94
- [27]高尚, 任佳伟, 李天润, 康仁科, Zhang, Yu.弹性磨抛轮加工硅片面形预测模型及试验验证[J],Surface Technology,2024,53(3):22-27
- [28]朱祥龙, 于力, 董志刚, 康仁科, 高尚.Study into grinding force in back grinding of wafer with outer rim[J],Advances in Manufacturing,2022,8(3):361-368
- [29]高尚, 康仁科, 郭东明, Huang, Q.S..Study on the subsurface damage distribution of the silicon wafer ground by diamond wheel[J],Advanced materials research,2022,126-128:113-118
- [30]康仁科, 高尚, 金洙吉, 郭东明.Study on Grinding Performance of Soft Abrasive Wheel for Silicon Wafer[A],ADVANCES IN GRINDING AND ABRASIVE TECHNOLOGY XV,2022,416:529-534
- [31]康仁科, 高尚, 金洙吉, 郭东明.Study on grinding performance of soft abrasive wheel for silicon wafer[J],KEY ENGINEERING MATERIALS,2022,416:529-534
- [32]高尚, 康仁科, 朱祥龙, 郭东明.Surface and subsurface integrity of glass-ceramics induced by ultra-precision grinding[A],18th International Symposium on Advances in Abrasive Technology, ISAAT 2015,2022
- [33]高尚, 康仁科, 董志刚, 张璧, Wang, Zi-Guang.Surface integrity and removal mechanism in grinding sapphire wafers with novel vitrified bond d...[J],MATERIALS AND MANUFACTURING PROCESSES,2022,32(2):121-126
- [34]董志刚, 高尚, Huang, Han, 康仁科, Wang, Ziguang.Surface integrity and removal mechanism of chemical mechanical grinding of silicon wafers using...[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2022,83(5-8):1231-1239
- [35]高尚, Huang, Han, 朱祥龙, 康仁科.Surface integrity and removal mechanism of silicon wafers in chemo-mechanical grinding using a ...[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2022,63:97-106
- [36]高尚, 康仁科, 董志刚.Surface layer damage of quartz glass induced by ultra-precision grinding with different grit size[A],The Second International Conference on Applied Engineering, Materials and Mechanics (ICAEMM 2017),2022,872:19-24
- [37]康仁科, Zeng, Y.F., 高尚, 董志刚, 郭东明.Surface layer damage of silicon wafers sliced by wire saw process[J],Advanced materials research,2022,797:685-690
- [38]高尚, Huang, Han.Recent advances in micro- and nano-machining technologies[J],机械工程前沿,2022,12(1,SI):18-32
- [39]Liu, H.J., 康仁科, 高尚, 周平, Tong, Y., 郭东明.Development of a measuring equipment for silicon wafer warp[J],Advanced materials research,2022,797:561-565
- [40]高尚, 董志刚, 康仁科, 张璧, 郭东明.Warping of silicon wafers subjected to back-grinding process[J],PRECISION ENGINEERING JOURNAL OF THE AMERICAN SOCIETY FOR PRECISION ENGINEE,2022,40:87-93