![]() |
个人信息Personal Information
教授
博士生导师
硕士生导师
性别:男
毕业院校:大连理工大学
学位:博士
所在单位:机械工程学院
学科:机械制造及其自动化
办公地点:机械工程学院高性能制造研究所#5015室
联系方式:手机:15104088992
电子邮箱:gaoshang@dlut.edu.cn
扫描关注
- [41]张玉, 康仁科, 高尚, Huang, Jinxing, 朱祥龙.A new model of grit cutting depth in wafer rotational grinding considering the effect of the grin...[J],PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY,2022,72:461-468
- [42]杨国林, 董志刚, 高尚, 鲍岩, 康仁科, 郭东明.A novel reverse helical milling process for reducing push-out delamination of CFRP[J],COMPOSITE STRUCTURES,2022,253
- [43]高尚, 董志刚, 康仁科, 郭东明.Design and evaluation of soft abrasive grinding wheels for silicon wafers[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B JOURNAL OF EN,2022,227(B4):578-586
- [44]Wu, Y. Q., 高尚, 康仁科, 黄昊.Deformation patterns and fracture stress of beta-phase gallium oxide single crystal obtained us...[J],JOURNAL OF MATERIALS SCIENCE,2022,54(3):1958-1966
- [45]高尚, Wu, Yueqin, 康仁科, Huang, Han.Nanogrinding induced surface and deformation mechanism of single crystal beta-Ga2O3[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2022,79:165-170
- [46]董志刚, 高尚, 周平, 康仁科, 郭东明.Grinding performance evaluation of the developed chemo-mechanical grinding (CMG) tools for sapphi...[J],Advanced materials research,2022,565:105-110
- [47]Liu, Zhiqiang, 康仁科, Haijun, 董志刚, 鲍岩, 高尚, 朱祥龙.FEM-based optimization approach to machining strategy for thin-walled parts made of hard and br...[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2022,110(5-6):1399-1413
- [48]朱祥龙, 于力, 董志刚, 康仁科, 高尚, Li, Liansheng.Grinding Marks in Back Grinding of Wafer with Outer Rim[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART C JOURNAL OF ME,2022,234(16):3195-3206
- [49]高尚, 康仁科, 董志刚, 张璧.Edge chipping of silicon wafers in diamond grinding[J],INTERNATIONAL JOURNAL OF MACHINE TOOLS MANUFACTURE,2022,64:31-37
- [50]董志刚, 张倩, Liu, Haijun, 康仁科, 高尚.Effects of taping on grinding quality of silicon wafers in backgrinding[J],FRONTIERS OF MECHANICAL ENGINEERING,2022,16(3):559-569
- [51]高尚, Li, Honggang, 康仁科, 张玉, 董志刚.Effect of Strain Rate on the Deformation Characteristic of AlN Ceramics under Scratching[J],MICROMACHINES,2022,12(1)
- [52]高尚, 董志刚, 康仁科, 张璧, 郭东明.Warping of silicon wafers subjected to back-thinning process[J],PRECISION ENGINEERING JOURNAL OF THE AMERICAN SOCIETY FOR PRECISION ENGINEE,2022,40(-):87-93
- [53]Cai, Linquan, 郭晓光, 高尚, 李志远, 康仁科.Material removal mechanism and deformation characteristics of AIN ceramics under nanoscratching[J],CERAMICS INTERNATIONAL,2022,45(16):20545-20554
- [54]高尚, 康仁科, 郭晓光.Grinding performance of diamond grinding tools for sapphire crystal[A],17th International Symposium on Advances in Abrasive Technology, ISAAT 2014,2022,117(-):544-548
- [55]Wu, Y. Q., 高尚, 黄昊.The deformation pattern of single crystal β-Ga2O3 under nanoindentation[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2022,71(-):321-325
- [56]李子源, 高尚, 康仁科, 李洪刚, 郭晓光.A comparative study of lapping and grinding induced surface/subsurface damage of silicon wafers a...[J],International Journal of Abrasive Technology,2022,10(2):122-133
- [57]高尚, 康仁科, 董志刚, 郭东明.工件旋转法磨削硅片的亚表面损伤分布[J],机械工程学报,2022,3:88-94
- [58]高尚, 王紫光, 康仁科, 董志刚, 张璧.工件旋转法磨削硅片的磨粒切削深度模型[J],机械工程学报,2022,17:86-93
- [59]高尚, 朱祥龙, 康仁科, 郭东明, 王紫光, 张璧.微晶玻璃超精密磨削的表面/亚表面损伤及其材料去除机理研究[J],机械工程学报,2022,7:180-188
- [60]高尚, Li, Honggang, 康仁科, He, Yiwei, 朱祥龙.新一代半导体材料氧化镓单晶的制备方法及其超精密加工技术研究进展[J],Jixie Gongcheng Xuebao/Journal of Mechanical Engineering,2022,57(9):213-232