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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[1]Zhang, Shuye, Huang, Mingliang, Wu, Yang, Yang, Ming, Lin, Tiesong, He, Peng, Paik, Kyung-Wook.A Study on the Oxygen Plasma Treatment on the Peel Adhesion Strength and Solder Wettability of ...[A],2019,2019-May:2022-2028
[2]黄明亮, J.M. Kuang, H.Y. Sun.Electromigration-induced β-Sn grain rotation in lead-free flip chip solder bumps[A],2019,2036-2041
[3]Chunyan Lu, Feifei Huang, 黄明亮.Effects of Electroplating Process Parameters on Properties of Co-electroplated Au-Sn alloy[A],2019,1-5
[4]Zhijie Zhang, 黄明亮.Abnormal migration behavior and segration mechanism of Bi atoms undergoing liquid-solid electromi...[J],Journal Materials Science,2019,54:7975-7986
[5]Kunwar, Anil, Ma, Haoran, Haitao, Sun, Junhao, Zhao, Ning, Huang, Mingliang, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg so...[J],MATERIALS LETTERS,2018,230:76-76
[6]Shang, Shengyan, Kunwar, Anil, Yao, Jinye, Wang, Yunpeng, Zhao, Ning, Huang, Mingliang, Ma, Haitao, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..All-round suppression of Cu6Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(18,SI):15966-15972
[7]黄明亮, 孙洪羽, Huang, ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Key Lab Liaoning Adv Welding & Joining Technol, Dalian 116024, Peoples R China..倒装芯片无铅凸点β-Sn晶粒取向与电迁移交互作用[J],金属学报,2018,54(07):1077-1086
[8]Lv, Qipeng, Huang, Mingliang, Zhang, Shaoqian, Deng, Songwen, Gong, Faquan, Wang, Feng, Pan, Yanwei, Li, Gang, Jin, Yuqi, ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China., Li, G (reprint author), Chinese Acad Sci, Dalian Inst Chem Phys, Key Lab Chem Lasers, Dalian 116023.Effects of Annealing on Residual Stress in Ta2O5 Films Deposited by Dual Ion Beam Sputtering[J],COATINGS,2018,8(4)
[9]Ma, Haoran, Kunwar, Anil, Liu, Zhiyuan, Chen, Jun, Wang, Yunpeng, Huang, Mingliang, Zhao, Ning, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and coolin...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(6):4383-4390
[10]Zhang, Shuye, Yang, Ming, Wu, Yang, Du, Jikun, Lin, Tiesong, He, Peng, Huang, Mingliang, Paik, Kyung-Wook, KW (reprint author), Korea Adv Inst Sci & Technol, Dept Mat Sci & Engn, Daejeon 34141, South Korea..A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Boar...[J],IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2018,8(3):383-391

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