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Scientific Research
Mingliang Huang
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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Scientific Research
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Zhang, Shuye, Huang, Mingliang, Wu, Yang, Yang, Ming, Lin, Tiesong, He, Peng, Paik, Kyung-Wook.A Study on the Oxygen Plasma Treatment on the Peel Adhesion Strength and Solder Wettability of SnBi58 based Anisotropic Conductive Films[A],2019,2019-May:2022-2028
黄明亮, J.M. Kuang, H.Y. Sun.Electromigration-induced β-Sn grain rotation in lead-free flip chip solder bumps[A],2019,2036-2041
Chunyan Lu, Feifei Huang, 黄明亮.Effects of Electroplating Process Parameters on Properties of Co-electroplated Au-Sn alloy[A],2019,1-5
Zhijie Zhang, 黄明亮.Abnormal migration behavior and segration mechanism of Bi atoms undergoing liquid-solid electromigration[J],Journal Materials Science,2019,54:7975-7986
Kunwar, Anil, Ma, Haoran, Haitao, Sun, Junhao, Zhao, Ning, Huang, Mingliang, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient (vol 172, pg 211, 2016)[J],MATERIALS LETTERS,2018,230:76-76
Shang, Shengyan, Kunwar, Anil, Yao, Jinye, Wang, Yunpeng, Zhao, Ning, Huang, Mingliang, Ma, Haitao, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..All-round suppression of Cu6Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(18,SI):15966-15972
Patents
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一种无氰Au-Sn合金镀液及其制备方法和应用
一种金属间化合物薄膜的制备方法
金属间化合物薄膜的制备方法
金属间化合物填充三维封装垂直通孔及其制备方法
一种三维封装芯片堆叠用金属间化合物键合方法及键合结构
倒装芯片用全金属间化合物互连焊点的制备方法及结构
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航天电子微小尺度互连焊点可靠性基础研究, 省、市、自治区科技项目, 2019/01/01, 在研
航天电子产品微互联焊点在尺度效应及多应力耦合作用下失效机理, 国家自然科学基金项目, 2018/12/01-2023/03/31, 结题
低温混装焊接工艺及可靠性技术研究项目, 企事业单位委托科技项目, 2018/07/30-2019/05/31, 结题
基于3D封装的纳米孪晶Cu互连机理与可靠性, 国家自然科学基金项目, 2016/08/17, 结题
先进铝铜焊接材料与技术, 地市厅局(含县)项目, 2016/08/09-2023/09/13, 结题
2015年科技部创新人才推进计划中青年科技创新领军人才-黄明亮, 国家科技部, 2016/05/17-2023/09/14, 结题