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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[511]杨睿, 郭东明, 贾振元.理想材料零件材料信息表述及处理的研究[J],中国机械工程,2006,17(2):164-167
[512]Wang, Xuyue, Kang, Renke, Xu, Wenji, Guo, Dongming.Direct laser fabrication of aluminum-alloy slot antenna array[A],2006,2006:1088-+
[513]Iiu, R. H., Jin, Z. J., Guo, D. M., Kang, R. K..Experimental study on influences of dispersant on dispersion and stability of CMP slurry with s...[A],2006,341-346
[514]Sun, Y. W., Jia, Z. Y., Guo, D. M., Meng, L. H..Development of a global-local geometric planning approach to automated part finishing processes[A],2006,37-44
[515]Gao, H, Kang, RK, Guo, DM, Li, J, H (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian, Peoples R China..Development of grinding temperature measuring system considering compensation of thermocouple d...[J],13th Conference on Abrasive Technology in China,2006,304-305:127-130
[516]Wang, DX, Guo, DM, Jia, ZY, Leng, HW, DX (reprint author), Yantai Univ, Sch Electromech & Automobile Engn, Yantai 264005, Peoples R China..Slicing of CAD models in color STL format[J],COMPUTERS IN INDUSTRY,2006,57(1):3-10
[517]Li, X.J., Guo, D.M., Ren, R.K., Jin, Z.J..Research on effects of slurry additives in Cu CMP for ULSI manufacturing[A],2006,304-305:350-354
[518]Cong Ming, Zhou Yumin, Jiang Ying, Kang Renke, Guo Dongming.An automated wafer-handling system based on the integrated circuit equipments[A],2006,240-+
[519]Li, Q. Z., Jin, Z. L., Kang, R. K., Guo, D. M., Zhang, R..Experimental study on influences of organic alkali on material removal rate of CuCMP[A],2006,317-322
[520]Su, J. X., Guo, D. M., Kang, R. K., Li, Q. Z..Analysis on material removal rate in wafer chemical mechanical polishing based on trajectory of...[A],2006,335-340

total751 52/76

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