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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[91]黄河, 颜超, 赖新春, 刘天伟, 张庆瑜, Lai, XC (reprint author), China Acad Engn Phys, Mianyang 621700, Peoples R China..Ti(0001)表面低能沉积Ti原子的分子动力学模拟[J],金属学报,2009,45(2):211-216
[92]张庆瑜.Study on low-energy bombardment of Au (1 1 1) by noble metal atoms with molecular dynamics simula...[J],Applied Surface Science,2009,355(1):3875-3879
[93]马春雨, 张庆瑜.反应溅射法制备铝钛掺杂氧化锆薄膜及其热稳定性[J],材料科学与工程学报,2009,26(12):64-66
[94]Guan, Qingfeng, Wang, Xuetao, Zhu, Jian, Chen, Kangmin, Liang, Liang, Zhang, Qingyu, Dong, Chuang, QF (reprint author), Jiangsu Univ, Coll Mat Sci & Engn, Zhenjiang 212013, Peoples R China..Fabrication of Micropore on AISI 304L Austenitic Stainless Steel Surface by High-current Pulsed...[J],ISIJ INTERNATIONAL,2009,49(9):1449-1451
[95]孙剑, 谷建峰, 刘明, 张庆瑜, 白亦真, Sun, J.(sunjian81516@yahoo.com.cn).基片温度对金刚石上沉积ZnO薄膜特性的影响[J],半导体光电,2008,29(6):884-887,892
[96]唐鑫, 张庆瑜, 赵纪军, 马春雨, 吕海峰, Zhang, QY (reprint author), Dalian Univ Technol, State Key Lab Mat Modificat Laser Ion & Electron, Dalian 116024, Peoples R China..Be掺杂纤锌矿ZnO电子结构的第一性原理研究[J],物理学报,2008,57(12):7806-7813
[97]Tian, Haining, Yang, Xichuan, Pan, Jingxi, Chen, Ruikui, Liu, Ming, Zhang, Qingyu, Hagfeldt, Anders, Sun, Licheng, HN (reprint author), Dalian Univ Technol, State Key Lab Fine Chem, KTH Joint Educ & Res Ctr Mol Devices, 158 Zhongshan Rd, Dalian 116012, Peoples R China..A Triphenylamine Dye Model for the Study of Intramolecular Energy Transfer and Charge Transfer ...[J],ADVANCED FUNCTIONAL MATERIALS,2008,18(21):3461-3468
[98]刘明, 魏玮, 曲盛薇, 谷建峰, 马春雨, 张庆瑜, Liu, M (reprint author), Dalian Univ Technol, State Key Lab Mat Modificat Laser Ion & Electron, Dalian 116024, Peoples R China..氧分压对磁控溅射ZnO薄膜生长行为和光学特性的影响[J],无机材料学报,2008,23(6):1096-1100
[99]马春雨, 李智, 张庆瑜.反应溅射法制备铝钛掺杂氧化锆薄膜及其热稳定的研究[A],2008,152-159
[100]马小叶, 姜雪宁, 孟宪芹, 庞胜利, 孟昕, 张庆瑜, Ma, XY (reprint author), Dalian Univ Technol, State Key Lab Mat Modificat Laser Ion & Elect Bea, Dalian 116024, Peoples R China..沉积温度对Gd掺杂CeO2电解质薄膜生长及电学特性的影响[J],无机材料学报,2008,23(5):912-916

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