Personal Information

Associate Professor Supervisor of Master's Candidates

Paper Publications

[11]zhujiang, Rui Yang, Wang, J.-P., wangxiong, Lattery, D.M., chenjun, zhangdong, Gu, X., Park, H., tangda, liming, duxin.Revealing the anisotropic thermal conductivity using time-resolved magneto-optical Kerr effect[A],International Heat Transfer Conference,2022,2018-August:2575-2582
[12]ANIL KUNWAR, Guo, Bingfeng, Shang, Shengyan, Raback, Peter, wangyunpeng, chenjun, mahaitao, Xueguan Song, Zhao Ning.Roles of interfacial heat transfer and relative solder height on segregated growth behavior of ...[J],INTERMETALLICS,2022,93:186-196
[13]Guo, Bingfeng, Jiang, Chengrong, ANIL KUNWAR, Zhao Ning, chenjun, wangyunpeng, mahaitao.Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal ...[A],2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT),2022,1087-1091
[14]Junzhou Huo, Wu H., chenjun.Dynamics simulation of stirling engine for solar energy based on the time-varying support stiffne...[J],Open Mechanical Engineering Journal,2022,8(1):710-715
[15]lvxingjun, chenjun, lixiang, George, Liu, Z..Effects of temperature and time on microstructure and microwave electromagnetic properties of N...[J],MATERIALS TECHNOLOGY,2022,29(3):159-166
[16]Peng, Wenhai, haoshengzhi, Zhao, Limin, chenjun, liwei.Formation mechanism of graphite nanospheres in W-C-Co system under high current pulsed electron...[J],MATERIALS LETTERS,2022,244:207-210
[17]mahaoran, wangyunpeng, chenjun, ANIL KUNWAR, mahaitao, Zhao Ning.Geometrical outline evolution and size-inhibiting interaction of interfacial solder bubbles and...[J],真空,2022,145:103-111
[18]ANIL KUNWAR, Shang, Shengyan, Raback, Peter, wangyunpeng, Givernaud, Julien, chenjun, mahaitao, Xueguan Song, Zhao Ning.Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetall...[J],MICROELECTRONICS AND RELIABILITY,2022,80:55-67
[19]Guo, Bingfeng, Jiang, Chengrong, ANIL KUNWAR, chenjun, Zhao Ning, wangyunpeng, mahaitao.In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/...[A],2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT),2022,974-979
[20]jinshijie, LUO Zhongbing, chenjun, Lin Li.Investigations on relationship between porosity and ultrasonic attenuation coefficient in CFRP la...[A],7th International Symposium on NDT in Aerospace,2022

total163 2/17

first previous next last Page

Home

Scientific Research

Teaching Research

Awards and Honours

Enrollment Information

Student Information

My Album

Blog

Personal Information

Paper Publications