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Associate Professor Supervisor of Master's Candidates

Paper Publications

[21]Lin Li, chenjun.Investigations on ultrasonic testing of porosity of advanced composite materials based on random ...[A],18th Ultrasonic NDE Workshop of Korea,2022,15-20
[22]Lin Li, chenjun, liximeng.Investigations on void morphology in CFRP composite materials and ultrasonic scattering attenuati...[A],Proceedings of Review of Progress in Quantitative Nondestructive Evaluation,2022
[23]Lin Li, Ding, S. S., chenjun, Liang, X. Y., liximeng.INVESTIGATIONS ON VOID MORPHOLOGY IN CFRP COMPOSITE MATERIALS AND ULTRASONIC SCATTERING ATTENUA...[A],38th Annual Review of Progress in Quantitative Nondestructive Evaluation (QNDE),2022,1430(31):1072-1079
[24]Cao, R., zhuhong, wangqi, dongchuang, linqiang, chenjun.Joining mechanisms of Mg-steel butt welded joints by cold metal transfer method[J],Hanjie Xuebao/Transactions of the China Welding Institution,2022,37(5):37-40
[25]chenjun, Lin Li, haoshengzhi, leimingkai.Temperature field simulation of nitride hard film irradiated by High-intensity Pulsed Ion Beam[A],The 7th International Forum on Advanced Material Science and Technology,2022
[26]chenjun, Xing, J., Lin Li, Hao, S. Z., leimingkai.Temperature field simulation of nitride hard film irradiated by High-intensity Pulsed Ion Beam[A],7th International Forum on Advanced Material Science and Technology,2022,675-677:521-+
[27]mahaoran, dongchuang, Shang, M., Hussain, M. M., wangyunping, lixiaoguang, mahaitao, chenjun.Temperature-induced effect and control of Cu3Sn on the rotation of orientation-preferred Cu6Sn5 c...[J],MATERIALS CHARACTERIZATION,2022,171
[28]mahaoran, lishichang, Yao, M. J., wangyunpeng, chenjun, Zhao Ning, mahaitao.The effect of cooling rate on growth kinetics of interfacial IMCs during multiple reflows[A],2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT),2022,1323-1326
[29]mahaoran, wangyunpeng, chenjun, mahaitao, Zhao Ning.The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during mult...[A],2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT),2022,1402-1405
[30]Peng, Wenhai, haoshengzhi, Zhao, Limin, Li, Ziqi, chenjun, Lan, Jia'ni, Wang, Xinglei, Kaiyi.Thermal stability of modified surface microstructure on WC-Co cemented carbide after high curre...[J],JOURNAL OF ALLOYS AND COMPOUNDS,2022,829

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