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一种提高碳化硅半导体欧姆接触特性的方法

Release Time:2022-10-19  Hits:

First Author: Dejun WANG

Disigner of the Invention: Qin Fuwen,黄玲琴,李青洙

Institution: 电子信息与电气工程学部

Application Number: CN105702712A

Authorization Number: CN201610066721.1

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