Release Time:2022-10-19 Hits:
First Author: Dejun WANG
Disigner of the Invention: Qin Fuwen
Institution: 电子信息与电气工程学部
Application Number: 201510735852.x
Prev One:一种提高碳化硅半导体欧姆接触特性的方法
Next One:采用金属基片制备垂直GaN基LED芯片的设备