Release Time:2019-03-10  Hits:

Indexed by: Journal Article

Date of Publication: 2002-05-23

Journal: 半导体技术

Included Journals: CSCD、ISTIC、PKU

Volume: 27

Issue: 5

Page Number: 69-72

ISSN: 1003-353X

Key Words: 等离子体损伤;器件的可靠性;半导休工艺

Abstract: 介绍了微细加工中等离子体工艺对器件的损伤.主要有两种损伤模式:充电效应引起的损伤和辐射损伤.讨论了两种损伤模式的等离子体过程及损伤机制.