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Paper Publications

[21]Li, Xiaona, Ding, Jianxin, Wang, Miao, Chu, Jinn P., Dong, Chuang, XN (reprint author), Dalian Univ Technol, Key Lab Mat Modificat Laser Ion & Electron Beams, Minist Educ, Dalian 116024, Peoples R China..Application of cluster-plus-glue-atom model to barrierless Cu-Ni-Ti and Cu-Ni-Ta films[J],JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A,2014,32(6)
[22]Li, X. N., Ding, J. X., Xu, L. Y., Bao, C. M., Chu, J. P., Dong, C., XN (reprint author), Dalian Univ Technol, Key Lab Mat Modificat Laser Ion & Electron Beams, Minist Educ, Dalian 116024, Peoples R China..Carbon-doped Cu films with self-forming passivation layer[J],SURFACE & COATINGS TECHNOLOGY,2014,244:9-14
[23]Li, X. N., Zhao, L. R., Bao, C. M., Chu, J. P., Dong, C., Wang, M., XN (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Mat Modificat Laser Ion & Electron Beams, Dalian 116024, Peoples R China..Thermal stability of barrierless Cu-Ni-Sn films[J],APPLIED SURFACE SCIENCE,2014,297:89-94
[24]李晓娜, 董闯.Stability and Microstructure Characterization of Barrierless Cu (Sn, C) Films[J],Advanced Materials Research,2014,52(10):163-168
[25]李晓娜, 李震, 董闯.基于团簇模型设计的Cu-Cu12-[Mx/(12+x)Ni12/(12+x)]5 (M = Si, Cr,Cr+Fe) 合金抗高温氧化研究[J],物理学报,2014,63(2)
[26]Li, Xiao Na, Zhao, Li Rong, Zhen, Liu, Li Jun, Bao, Cui Min, Chu, Jinn P., Dong, Chuang, XN (reprint author), Dalian Univ Technol, Minist Educ, Sch Mech Engn, Key Lab Mat Modificat Laser, Dalian 116024, Peoples R China..Barrierless Cu-Ni-Nb thin films on silicon with high thermal stability and low electrical resis...[J],JOURNAL OF MATERIALS RESEARCH,2013,28(24):3367-3373
[27]李晓娜, 赵丽荣, 李震, 刘立筠, 包翠敏, 朱瑾, 董闯.Barrierless Cu–Ni–Nb thin films on silicon with high thermal[J],J. Mater. Res.,2013,28(24):3367-3373
[28]Li, X. N., Dong, C., Wang, Q., Chu, J. P., Zhang, X. Y., Liu, L. J., XN (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Mat Modificat Laser Ion & Electron Beams, Dalian 116024, Peoples R China..Barrierless Cu-Ni-Mo Interconnect Films with High Thermal Stability Against Silicide Formation[J],JOURNAL OF ELECTRONIC MATERIALS,2012,41(12):3447-3452
[29]李晓娜, 刘立筠, 张心怡, 朱瑾, 王清, 董闯.Barrierless Cu-Ni-Mo Interconnect Films with High Thermal[J],Journal of ELECTRONIC MATERIALS,2012,41(12):3447-3452
[30]Li Xiao-Na, Zheng Yue-Hong, Li Sheng-Bin, Dong Chuang, Li, XN (reprint author), Dalian Univ Technol, Key Lab Mat Modificat Laser Ion & Electron Beam, Minist Educt, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..beta-Fe3Si8M ternary alloy thin films prepared by magnetron sputtering[J],ACTA PHYSICA SINICA,2012,61(24)

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